Planar inverted F antenna and method of making the same

ABSTRACT

A planar inverted F antenna having a radiating patch and a carrier is described. The radiating patch includes a blank, a first connector and a second connector. The first connector is formed from the blank material and provides a cutout region within the periphery of the radiating patch.

FIELD OF THE INVENTION

The present invention relates to antennas and, more particularly, toplanar inverted F antennas.

BACKGROUND OF THE INVENTION

RF antennas are widely used to provide wireless capability incommunication devices such as cellular telephones, wireless personaldigital assistants (PDAs), portable computers, electronic games, and thelike.

One common antenna is a planar inverted F antenna (the “PIFA”). The PIFAis a small antenna that can conveniently fit in most electronic devices.The PIFA includes a radiating patch, a carrier, and a ground plane. Theradiating patch includes a ground connector and a feed connector. In aknown PIFA, the ground and feed connectors extend from the periphery ofthe radiating patch for connection to the ground plane and power feed ofa wireless communication device, respectively. Alternatively, aninternal connection to the radiating patch has been provided by aseparate spring finger attached to either the carrier molding or to aprinted circuit board of the wireless communication device.

SUMMARY OF THE INVENTION

A radiating patch of a PIFA having at least one connector formed fromthe radiating patch material and provides a cutout region within theperiphery of the radiating patch. Further, a PIFA including such aradiation patch is provided also. The contact is formed by cuttingmaterial from a patch enabling the connector to be provided anywhere onthe radiating patch instead of being limited to the periphery of theradiating patch.

The present invention also provides a method of making the radiatingpatches and the PIFAs. The method includes providing a conductive blankhaving a periphery and cutting a first connector from a portion of theblank internal to the periphery. The first connector is bent away fromthe blank to form a cutout region in the blank. A second connector isformed on the conductive blank also.

The foregoing and other features, utilities and advantages of theinvention will be apparent from the following more particulardescription of a preferred embodiment of the invention as illustrated inthe accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWING

The above and other objects and advantages of the present invention willbe apparent upon consideration of the following detailed description,taken in conjunction with the accompanying drawings, in which likereference characters refer to like parts throughout, and in which:

FIG. 1 depicts a perspective view of an antenna illustrative of thepresent invention assembled onto a printed circuit board;

FIG. 2 depicts an exploded view of the antenna of FIG. 1;

FIG. 3 depicts a blank for forming a radiating patch of the antenna ofFIG. 1; and

FIG. 4 depicts bottom view of the radiating patch of the antenna FIG. 1.

DETAILED DESCRIPTION

FIG. 1 shows an assembled Planar Inverted F Antenna (PIFA) 4illustrative of the present invention, which may be used in a wirelesscommunication device such as a cellular telephone, a wireless personaldigital assistant (PDA), a laptop computer, and the like. The PIFA 4 isconnected to a printed circuit board (PCB) 1, which may be a componentof the wireless communication device.

FIG. 2 shows an exploded view of the PIFA 4 shown in FIG. 1. The PIFA 4includes a carrier 2 and a patch 3. The patch 3 is shaped to radiate RFenergy at particular frequencies. The patch 3, for example, may includeone or more internal, shaped cutout 32. Cutout 32 quasi partitions patch3 for multiband operation.

The patch further includes a ground connector 33 and a feed connector 34for electrically connecting the PIFA with a printed circuit board 1 of awireless communication device. The ground connector 33 and/or the feedconnector 34 may be plated with a suitable conductive material, such asnickel or gold, or may be left un-plated where desired. Where aconnector is formed from a corrosion-resistant material, such as acopper/nickel/zinc material, or where otherwise desired, the groundconnector 33 and/or the feed connector 34 may be left un-plated.

One or both of the connectors may be formed by cutting through the patch3. As shown in FIG. 2, for example, the feed connector 33 is formed bycutting through the patch 3 and leaving an internal cutout 31. For thepurposes of the present invention, the terms “cut” or “cutting” includeany means of forming a connector from within the periphery of the patch3 whether by stamping, cutting, etching, engraving, scoring, and thelike. Alternatively, a connector may be formed by cutting through thepatch 3, such that the cutout 31 extends to the periphery of the patch3. The cutout 31, whether internal or extending to the periphery of thepatch 3, influences the radiating of the PIFA 4 in the same manner asthe cutout 32. Although the cutout 31 is shown as a straight line, thecutout may alternatively form any other shape desired to improve the RFperformance of the PIFA 4. For example, the cutout 31 may alternativelyinclude a circle, an arc, a zig-zag line, a meander line, or any othergeometric or irregular shape as desired to alter the RF performance ofthe PIFA 4. Further, although the feed connector 34 shown in FIGS. 2 and4 is shown substantially coextensive with the cutout 31, the feedconnector 34 (or the ground connector 33) may also be a portion of alarger cutout area.

One of the connectors also may be formed by bending a portion extendingfrom the periphery of the patch 3. As shown in FIGS. 2–4, for example,the ground connector 33 is formed by bending a portion of the patch 3that extends beyond the periphery of the patch 3. In this manner, theconnectors may be formed at any position desired on the patch 3 of thePIFA 4.

The carrier 2 may be formed of any suitable non-conducting material suchas a dielectric or insulator material (e.g., plastic molding). Thecarrier 2 supports the patch 3 and maintains the patch 3 in the locationrelative to the PCB of a wireless communication device. The carrier maybe attached to the PCB by any means known in the art, such as byclipping, fixing with screws, and the like.

Pins 20 and/or locating blocks 22 may be used to align patch 3 oncarrier 2. The locating pins 20 align with holes 30 (or depressions) inthe patch 3. The locating blocks 22 align with cutout 32 and/or cutout31. The pins 20 and/or blocks 22 may be deformed, such as by heatstaking, to hold the patch 3 in place on the carrier 2. Alternatively,the patch 3 can be attached to the carrier by any other means known inthe art, such as adhesive, double-sided adhesive tape, clipping,soldering, and the like.

The carrier 2 may further include an opening 21 to allow the feedconnector 34 to make contact with a feed contact 11, such as a feed pador other contactor. Another opening 23 (or notch) further allows theground connector 33 to make contact with a ground contact 10, such as aground pad or other ground connector.

FIG. 3 shows a blank 5 that may be used to form the patch 3 shown inFIG. 2. The blank 5 may be formed by a thin metal or electricallyconductive plate such as a plate coated with an electrically conductivemetal. The blank may alternatively be formed, for example, by a moldedor cast plastic sheet coated with an electrically conductive material orformed by mixing an electrically conductive substance in a plastic rawmaterial.

FIG. 4 shows the underside of the patch 3 with the ground connector 33and the feed connector 34 formed. The shape of the connectors 33 and/or34 is preferably configured to ensure that adequate pressure ismaintained between the connectors 33 and/or 34 and the respective groundcontact 10 and feed contact 11 of a wireless communication device. Theconnectors 33 and/or 34 may also include dimples 35 and 36 to improvethe reliability of the connection between the connectors 33 and 34 ofthe PIFA and the contacts 10 and 11 of a wireless communication device.The shape of the connectors 33 and 34 may also be configured to aid inthe location and fixing of the patch 3 to the carrier 2. While notnecessary, connectors 33 and 34 should be formed from a material havingsome elasticity to facilitate the connectors.

While the invention has been particularly shown and described withreference to one or more embodiments herein, it will be understood bythose skilled in the art that various other changes in the form anddetails may be made without departing from the spirit and scope of theinvention.

1. A radiating patch for use in a planar inverted F antenna, theradiating patch comprising: an electrically conductive blank comprisinga periphery and forming a planar surface a first connector cut from theconductive blank and extending away from the blank in the firstdirection and forming a cutout region in and co-planar with theconductive blank; the cutout region being completely internal to theconductive blank; and a second connector extending away from the blankin the first direction, wherein a feed is connected to the firstconnector such that power is provided at a point internal to theconductive blank.
 2. The radiating patch of claim 1, wherein the firstconnector comprises a feed connector.
 3. The radiating patch of claim 1,wherein the second connector comprises a ground connector.
 4. Theradiating patch of claim 1, wherein the conductive blank comprises acorrosion-resistant material.
 5. The radiating patch of claim 1, whereinthe cutout comprises a radiating element.
 6. The radiating patch ofclaim 1, wherein the cutout comprises at least one of a straight line, acircle, a polygon, an arc, a zig-zag line and a meander line.
 7. Theradiating patch of claim 1, wherein the second connector is cut from theconductive blank forming another cutout region.
 8. A planar inverted Fantenna for use in a wireless communication device having a printedcircuit board, the antenna comprising: a radiating patch comprising aperiphery and forming a planar surface; a first connector for providinga first electrical connection to the printed circuit board of thewireless communication device, the first connector being cut from aninternal portion of the radiating patch and extending away from theradiating patch in a first direction; and forming a cutout regioninternal to and co-planar with the radiating patch; a second connectorfor providing a second electrical connection to the printed circuitboard of the wireless communication device; and a non-conductive carrierfor receiving the radiating patch, wherein a feed is connected to thefirst connector such that power is provided at a point internal to theconductive blank.
 9. The antenna of claim 8, wherein the carrier furthercomprises an opening to receive the first connector.
 10. The antenna ofclaim 8, wherein the carrier further comprises at least one locating pinfor aligning the radiating patch on the carrier.
 11. The antenna ofclaim 10, wherein the locating pin is deformed to secure the radiatingpatch to the carrier.
 12. The antenna of claim 8, wherein the carrierfurther comprises at least one locating block for aligning the radiatingpatch on the carrier.
 13. The antenna of claim 12, wherein the at leastone locating block is deformed to secure the radiating patch to thecarrier.
 14. The antenna of claim 10, wherein the carrier furthercomprises at least one locating block for aligning the radiating patchto the carrier.
 15. The antenna of claim 8, wherein the cutout comprisesa radiating element.
 16. The antenna of claim 8, wherein the cutoutcomprises at least one of a straight line, a circle, a polygon, an arc,a diagonal line and a meander line.
 17. The antenna of claim 8, whereinthe first connector aligns the radiating patch with the carrier.
 18. Theantenna of claim 8, wherein the first connector secures the radiatingpatch to the carrier.
 19. The antenna of claim 8, wherein the secondconnector is formed from another cutout.
 20. A planar inverted F antennafor use in a wireless communication device having a printed circuitboard, the antenna comprising: a radiating patch comprising a peripheryand forming a planar surface; means internal to the radiating patch forconnecting the radiating patch to the printed circuit board of thewireless communication device, the means for connecting forming a cutoutregion in and co-planar with the radiating patch, wherein a feed isconnected to means internal to the radiating patch for connecting suchthat power is provided to a point internal to the conductive blank; asecond connector for providing a second electrical connection to theprinted circuit board of the wireless communication device; and anon-conductive carrier for receiving the radiating patch.
 21. A methodof making a radiating patch for use in a planar inverted F antenna, themethod comprising: providing a conductive blank having a periphery andforming a planar surface; cutting a first connector from a portion ofthe conductive blank internal to the periphery of the conductive blankand co-planar with the conductive blank; and bending the first connectoraway from the conductive blank to form a cutout region internal to saidconductive blank; forming a second connector; and arranging theconductive blank over a feed such that the feed contacts the firstconnector to provide power at a point internal to the conductive blank.